Dynamic
Active Area : 129 x 129 mm
Image Size : 1536 x 1536
Scintillator : Direct Deposit Csl - TI
Pixel Pitch : 84 μm
Energy Range : 20 kV~225 kV
Frame Rate : 30 fps (1 x 1) / 20 fps (2 x 2)
Applications
- Electronic Inspection
- Battery Inspection
Features
- Superior Image Quality
- 20~250kV/450kV X-ray Voltage Range
- IP65 Design
Active Area : 151 x 201 mm
Image Size : 1536 x 2048
Scintillator : Direct Deposit Csl - TI
Pixel Pitch : 98 μm
Energy Range : 20 kV~225 kV
Frame Rate : 50 fps (1 x 1) / 55 fps (2 x 2)
Applications
- Fluoroscopy
Features
- IGZO TFT
- 300fps @ 1 x 1 (panoramic mode)
- Medium and large fields of view for versatile application
Active Area : 172 x 172 mm
Image Size : 2048 x 2048
Scintillator : Direct Deposit Csl - TI
Pixel Pitch : 84 μm
Energy Range : 20 kV~225 kV/450 kV
Frame Rate : 30 fps (1 x 1) / 60 fps (2 x 2)
Active Area : 430 x 430 mm
Image Size : 3072 x 3072
Scintillator : Direct Deposit Csl - TI
Pixel Pitch : 140 μm
Energy Range : 20 kV~160 kV
Frame Rate : 4 fps (1 x 1) / 12 fps (2 x 2)
Applications
- Chip Counting
- Electronic Inspection
Features
- Large Active Area
- Wide Dynamic Range
- Fast Imaging Output
Active Area : 304 x 304 mm
Image Size : 3072 x 3072
Scintillator : Direct Deposit Csl - TI
Pixel Pitch : 99 μm
Energy Range : 20 kV~225 kV/450 kV
Frame Rate : 30 fps (1 x 1) / 48 fps (2 x 2)
Applications
- Battery Inspection
- Electronic Inspection
Features
- High Frame Rate
- High Resolution
- Multi Dynamic Mode
Active Area : 304 x 304 mm
Image Size : 3072 x 3072
Scintillator : Direct Deposit Csl - TI
Pixel Pitch : 99 μm
Energy Range : 20 kV~225 kV/450 kV
Frame Rate : 12 fps (1 x 1) / 24 fps (2 x 2)
Active Area : 157 x 157 mm
Image Size : 1024 x 1024
Scintillator : Direct Deposit Csl - TI/GOS
Pixel Pitch : 154 μm
Energy Range : 20 kV~225 kV/450 kV
Frame Rate : 30 fps (1 x 1) / 15 fps (2 x 2)
Applications
- Industrial NDT
Features
- Internal components designed for optimal shielding and extended product life
- Compact and versatile hardware; complete customization available
- High frame rate and exceptional diagnostic imaging quality for industrial NDT
Active Area : 236 x 236 mm
Image Size : 1536 x 1536
Scintillator : Direct Deposit Csl - TI/GOS
Pixel Pitch : 154 μm
Energy Range : 20 kV~225 kV/450 kV
Frame Rate : 15 fps (1 x 1) / 29 fps (2 x 2)
Applications
- Fluoroscopy
- CBCT
- Industrial NDT
Features
- Internal components designed for optimal shielding and extended product life
- Compact and versatile hardware; complete customization available
- High frame rate and exceptional diagnostic imaging quality for industrial NDT
Active Area : 244 x 307 mm
Image Size : 2048 x 2560
Scintillator : Direct Deposit Csl - TI/GOS
Pixel Pitch : 120 μm
Energy Range : 20 kV~225 kV/450 kV
Frame Rate : 6 fps (1 x 1) / 24 fps (2 x 2)
Applications
- Fluoroscopy
- Industrial NDT
Features
- Internal components designed for optimal shielding and extended product life
- Greater efficiency with high speed performance and rapid image refresh rates
- 16 bit High Dynamic Range and low noise circuit design
Active Area : 244 x 307 mm
Image Size : 2048 x 2560
Scintillator : Direct Deposit Csl - TI/GOS
Pixel Pitch : 120 μm
Energy Range : 20 kV~225 kV/450 kV
Frame Rate : 17 fps (1 x 1) / 34 fps (2 x 2)
Active Area : 430 x 430 mm
Image Size : 3072 x 3072
Scintillator : Direct Deposit Csl - TI/GOS
Pixel Pitch : 140 μm
Energy Range : 20 kV~225 kV/450 kV
Frame Rate : 16 fps (1 x 1) / 31 fps (2 x 2)
Applications
- Die Casting
- Battery Inspection
Features
- Large Active Area
- 20~250/450KV X-ray Voltage Range
- High Frame Rate
Active Area : 430 x 430 mm
Image Size : 3072 x 3072
Scintillator : Direct Deposit Csl - TI/GOS
Pixel Pitch : 140 μm
Energy Range : 20 kV~225 kV/450 kV
Frame Rate : 40 fps (1 x 1) / 80 fps (2 x 2)
Active Area : 432 x 432 mm
Image Size : 2816 x 2816
Scintillator : Direct Deposit Csl - TI/GOS
Pixel Pitch : 154 μm
Energy Range : 20 kV~15 MeV
Frame Rate : 4 fps (1 x 1) / 15 fps (2 x 2)
Applications
- High-energy NDT
Features
- Internal components designed for optimal shielding and extended product life
- Streamlined integration with symmetrical design and standardized hardware